EVOQUE Attends Photonics Packaging Innovation at IMAPS Nordic 2025

Our partner, Tyndall National Institute, University College Cork, contributed to the Photonics Sensing and Packaging Workshop at IMAPS Nordic 2025, held last week in vibrant Copenhagen.

This collaborative event brought together a dynamic community of photonics experts, researchers, and industry leaders to explore one of the most critical enablers of photonics innovation: advanced packaging technologies. From high-density integration to thermal management and system-level design, the conversations underscored the essential role that smart packaging solutions play in unlocking the full potential of next-generation photonic systems.

A special thank you to the organizers and the workshop chair for curating such an engaging and technically rich program. Their efforts created an ideal platform for sharing insights, debating future trends, and identifying pathways for collaborative innovation.

At EVOQUE, our mission is to accelerate breakthroughs in photonic integration and packaging—and the workshop echoed that vision. We were particularly inspired by the insightful presentations from our fellow speakers, which addressed everything from novel interconnect solutions to reliability challenges in harsh environments.

As we look ahead, EVOQUE remains committed to fostering cross-border research collaboration and translating cutting-edge research into scalable impact. Events like IMAPS Nordic are vital touchpoints for aligning Europe’s research ecosystem around shared goals in photonics.

We’re excited to build on the momentum from Copenhagen and continue pushing the boundaries of what’s possible in photonics packaging.

Stay connected with us as we drive European photonics innovation forward.

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